Rajiv Yadlapalli
J.P. Morgan Head of Partnerships and Industry Solution Lead, Embedded Payments
Rajiv Yadlapalli is the Head of Partnerships and Industry Solutions Lead for J.P. Morgan Embedded Payments, where he drives business development opportunities for corporate clients and the software ecosystem that supports them. With over a decade of experience at J.P. Morgan, Rajiv has held diverse roles in strategy, product development, and structuring across custody, prime brokerage, derivatives clearing, corporate treasury, and cash management.
An engineer at heart, Rajiv applies advanced mathematics and operations research to financial innovation. He is a CFA Charterholder and holds a patent (#8738514) for his work in the field.
Outside of work, Rajiv balances the busy schedules of his three young daughters and enjoys hosting friends for low-and-slow BBQs and metal-inspired jam sessions.
2026 Agenda Sessions
2B or not 2B: Can B2B payments have it all?
Instant reconciliation. Embedded payments. Self-serve onboarding. B2B buyers expect the same ease they get from consumer tools, but with enterprise controls.
This session reveals how fintechs are winning the B2B payments battle with elegant UX, smart data, and real-time integrations.
Takeaways:
• Learn how embedded finance is transforming B2B payments.
• Hear how UX is becoming the competitive edge in commercial banking.
• Understand the backend infrastructure enabling real-time B2B flows.
Tuesday 31 March 09:35 - 10:15 Payments
Embedded Finance
Infrastructure & APIs
UX & Customer Experience
This session reveals how fintechs are winning the B2B payments battle with elegant UX, smart data, and real-time integrations.
Takeaways:
• Learn how embedded finance is transforming B2B payments.
• Hear how UX is becoming the competitive edge in commercial banking.
• Understand the backend infrastructure enabling real-time B2B flows. Payments US/Pacific
