Rajiv Yadlapalli

J.P. Morgan Head of Partnerships and Industry Solution Lead, Embedded Payments

Rajiv Yadlapalli is the Head of Partnerships and Industry Solutions Lead for J.P. Morgan Embedded Payments, where he drives business development opportunities for corporate clients and the software ecosystem that supports them. With over a decade of experience at J.P. Morgan, Rajiv has held diverse roles in strategy, product development, and structuring across custody, prime brokerage, derivatives clearing, corporate treasury, and cash management. 
 
An engineer at heart, Rajiv applies advanced mathematics and operations research to financial innovation. He is a CFA Charterholder and holds a patent (#8738514) for his work in the field. 
 
Outside of work, Rajiv balances the busy schedules of his three young daughters and enjoys hosting friends for low-and-slow BBQs and metal-inspired jam sessions.